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The new chipsets will be geared toward embedded memory in mobile products that call for large quantities of fast memory, such as mobile phones, flat panel HDTVs, and servers, as well as mobile audio-video devices. The new chipsets are planned for market in the first quarter of 2009.
Toshiba hasn't named customers but supplies both itself as well as Apple's handheld devices; multiple chips are often stacked together in a single package and should enable capacities of 16GB and higher depending on the hardware.
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